Tag: HDI PCB

Surface Mount vs Through Hole PCB Assembly Technology
Manufacturing PCB Assembly PCB Designing PCB Manufacturing

Surface Mount (SMT) vs Through Hole (THT) PCB Assembly Technology

Printed Circuit Board (PCB) assembly is the heart of modern electronic product manufacturing. Two primary methodologies dominate PCB assembly: Surface Mount Technology (SMT) and Through-Hole Technology (THT). Each technology has unique characteristics, advantages, limitations, and ideal use cases. This article presents a detailed, side-by-side examination of SMT and THT, covering fundamentals, process steps, component types, […]

High Density Interconnect HDI PCB
Electronics tutorial PCB Assembly PCB Designing PCB Manufacturing

Importance of High Density Interconnect (HDI) PCB

In this article you will learn about High Density Interconnect HDI PCB. The basic definition, how it differs from simple PCBs, and the benefits of high-density interconnect boards. We will explore the application areas and understand the importance of PCB in this category. We are living in the era of miniaturization. Every person living on […]